PS21553-G Overview
DIP and mini-DIP IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra pact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs, DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design time.
PS21553-G Key Features
- pact Packages
- Single Power Supply
- Integrated HVICs
- Direct Connection to CPU
- Optimized for 15kHz Operation